【 Master chip platform 】

Zhaoyi Innovation, Hangshun, Huada, Xintang, ST, Guoxin, Guoxin, Jihai, Xinhai, Yizhaowei, Furikun, Nordic, ti, NXP, Taixin, Tongfangwei, STC

[Development Language]

Core: C language

Extension support: Java, C++

[Core Process]

System Organization Structure

Interactive logic

Function allocation

interface design

Operational Design

Data structure design

Error handling design

Function extension reservation

Online upgrade

[Operation Platform]

MCU

Android

WINDOWS

LINUX

RTOS

OPENCPU

Product Support

Agreement Document

Interface documentation

Specification

Test the demo source code

PC Test Tools

Remote upgrade tool

Production software tools

Test software tools

[Output Type]

firmware

APK

Android sdk

MCU software library

WINDOWS DLL Library

Systems Middleware

EXE

[Extension Support]

Easy customization of different system application software

Customization and development of some functions of Android system

【 Master chip platform 】

Zhaoyi Innovation, Hangshun, Huada, Xintang, ST, Guoxin, Guoxin, Jihai, Xinhai, Yizhaowei, Furikun, Nordic, ti, NXP, Taixin, Tongfangwei, STC

[Development Language]

Core: C language

Extension support: Java, C++

[Core Process]

System Organization Structure

Interactive logic

Function allocation

interface design

Operational Design

Data structure design

Error handling design

Function extension reservation

Online upgrade

[Operation Platform]

MCU

Android

WINDOWS

LINUX

RTOS

OPENCPU

Product Support

Agreement Document

Interface documentation

Specification

Test the demo source code

PC Test Tools

Remote upgrade tool

Production software tools

Test software tools

[Output Type]

firmware

APK

Android sdk

MCU software library

WINDOWS DLL Library

Systems Middleware

EXE

[Extension Support]

Easy customization of different system application software

Customization and development of some functions of Android system

Process Capability

Number of layers/flexible layers: 16/6

Minimum line width/spacing: 3.0 mils

Minimum mechanical drilling hole diameter: 0.25mm

Plate thickness to aperture ratio: 20:1

Impedance tolerance (Ω): ± 3 (<30) ± 10% (≥ 30)

Surface treatment processes: lead spray tin, chemical gold precipitation, chemical nickel palladium gold precipitation, tin precipitation, silver precipitation, full plate gold plating, organic coating treatment, lead free tin spraying, hard gold plating, soft gold plating, gold fingers, etc

Conventional materials: PET, PEN, PI, FR-4, BT resin

Special materials: halogen free, high-frequency (Rogers, DuPont), etc.

[Production capacity]

Batch size: 100 million square meters/month

Sample: 10-30 models/day

Shipment: sample 10-12 days, batch size: 15-25 days

Process Capability

Number of layers: 1-4

Plate thickness: 0.1mm-0.6mm

Minimum line width/spacing: 3.0 mils

Minimum mechanical drilling hole diameter: 0.25mm

Impedance tolerance (Ω): ± 3 (<30) ± 10% (≥ 30)

Surface treatment processes: lead spray tin, chemical gold precipitation, chemical nickel palladium gold precipitation, tin precipitation, silver precipitation, full plate gold plating, organic coating treatment, lead free tin spraying, hard gold plating, soft gold plating, gold fingers, etc

Conventional material: FR-4, BT resin

Special materials: halogen free, high-frequency (Rogers, DuPont), etc

[Production capacity]

Batch size: 150 million square meters/month

Sample: 50-80 models/day

Shipment: sample 1 - 5 days, batch size: 8 - 20 days

[Material/Device Performance Analysis Solution]

[PCB/PCBA/Structure Function+Performance Analysis Service Platform]

[Product pre certification service platform]

[EMVCo Contactless IC Card - Terminal Test]

[Component based circuit board process control evaluation solution]

[RFID Antenna Evaluation Solution]

[Routine circuit board process control analysis solution]