Factory Services

    Microelectronics Manufacturing Technology

    Process Capability




    Number of layers: 1-4




    Plate thickness: 0.1mm-0.6mm




    Minimum line width/spacing: 3.0 mils




    Minimum mechanical drilling hole diameter: 0.25mm




    Impedance tolerance (Ω): ± 3 (<30) ± 10% (≥ 30)




    Surface treatment processes: lead spray tin, chemical gold precipitation, chemical nickel palladium gold precipitation, tin precipitation, silver precipitation, full plate gold plating, organic coating treatment, lead free tin spraying, hard gold plating, soft gold plating, gold fingers, etc




    Conventional material: FR-4, BT resin




    Special materials: halogen free, high-frequency (Rogers, DuPont), etc




    [Production capacity]




    Batch size: 150 million square meters/month




    Sample: 50-80 models/day




    Shipment: sample 1 - 5 days, batch size: 8 - 20 days